Direct To Chip Cooling

Leading the next generation of advanced thermal management, Two-Phase Direct-to-Chip Cooling utilizes refrigerant evaporation to efficiently dissipate heat directly from high-performance chips. This next-gen cooling technology is transforming data centers, high-performance computing (HPC), 5G infrastructure, AI-driven processing, and electric vehicle (EV) power systems by reducing thermal resistance and enhancing system performance. By minimizing cooling energy consumption, it helps data centers achieve ultra-low Power Usage Effectiveness (PUE), improve energy efficiency, and lower operational costs. This high-efficiency cooling solution sets a new standard for sustainable, low-latency, and high-density computing environments.

Our state-of-the-art HFO refrigerants are engineered to seamlessly complement this advanced cooling system. Delivering unparalleled thermal performance, safety, and environmental sustainability, they ensure your systems are both highly efficient and eco-friendly. 

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•Low Global Warming Potential (GWP): Fully compliant with global regulatory standards, aligning with sustainability initiatives as replacements of HFC.

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•Safe and Reliable: Non-flammable, non-toxic dielectric fluids minimize risks, ensuring no damage even in accidental leaks.

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•Versatile Applications: With a range of products offering low to medium boiling points, they adapt to diverse working conditions and environments.