Octafluorocyclobutane
Plasma Etching Gas
Octafluorocyclobutane is an important etching gas in the plasma etching process of the electronics industry.
Special Features:
Ultra High Purity Tailored To Your Requirements
Excellent Etching Rate & Selectivity
Product Availability
Sample | Available |
Commercial | Available |
ISO Tank | Available |
Custom Packaging | Upon Request |
Product Description
Chemical Name | Octafluorocyclobutane |
Synonyms | Perfluorocyclobutane, R-C318 |
CAS # | 115-25-3 |
ELINCS # (EU) | 204-075-2 |
Molecular Formula | CC4F8 |
Structure |
|
Molecular Weight | 200.03 |
ODP（CFC-11 = 1） | 0 |
GWP100（CO2 = 1） | 3200 |
Atmospheric Life Time (Days) | 10300 |
Product Properties
Chemical Name | Octafluorocyclobutane |
Boiling Point(℃) | -5.8 |
Melting Point（℃） | -40.1 |
Liquid Density ( -5.8℃, g/cm³） | 1.637 |
Vapor Density (Air=1) | 7.0 |
Saturated Vapor Pressure（@20℃, bar） | 2.7 |
Critical Temperature（℃） | 115.3 |
Critical Pressure（MPa） | 2.79 |
Solubility in water (mg/L) | 140 |
Flash Point（℃） | Not applicable (non-flammable) |
Flammability (@21℃) | Not applicable (non-flammable) |
Explosion Limit（%vol) | Not applicable (non-flammable) |